ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,127, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Method of forming composite mask patterns of... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,128, issued on Aug. 25, was assigned to Advanced Micro Devices Inc. (Santa Clara, Calif.). "Standard cell layout architectures and drawing ... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,129, issued on Aug. 25, was assigned to Micron Technology Inc. (Boise, Idaho). "Memory arrays comprising strings of memory cells and method... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,130, issued on Aug. 25, was assigned to Intel Corp. (Santa Clara, Calif.). "Dual-sided terminal device with split signal and power routing"... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,131, issued on Aug. 25, was assigned to FRAUNHOFER-GESELLSCHAFT ZUR FORDERUNG DER ANGEWANDTEN FORSCHUNG E.V. (Munich). "Cryo-compatible qua... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,133, issued on Aug. 25, was assigned to Yangtze Memory Technologies Co. Ltd. (Wuhan, China). "Contact structure and method of forming the s... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,134, issued on Aug. 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Conductive structures of integrated... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,135, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Integrated circuit device" was invented b... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,136, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor package and method for manu... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,137, issued on Aug. 25, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor package structure... Read More